发明名称 HIGH IMPEDANCE ELECTRICAL CONNECTION VIA
摘要 <p>Vias (106) are typically of a lower impedance than the signal lines (102, 128) connected to them. The noise and reflected signals resulting in impedance mismatch may require circuits to be operated at a frequency far lower than desired. An embodiment avoids impedance mismatch in circuits and achieves an advance in the art by providing a via (106) with higher impedance through the addition of split ring resonators (104, 112, 120, 126) to each end of the via (106).</p>
申请公布号 WO2011053396(A1) 申请公布日期 2011.05.05
申请号 WO2010US42129 申请日期 2010.07.15
申请人 XILINX, INC. 发明人 WYLAND, CHRISTOPHER, P.
分类号 H01L23/66 主分类号 H01L23/66
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