发明名称 SURFACE MOUNT FOOTPRINT IN-LINE CAPACITANCE
摘要 An interconnection system with capacitors integrated into a printed circuit board footprint of an electrical connector. One end of each capacitor shares a pad on the printed circuit board with a contact tail of a conductive element in a connector. The shared pads are not connected through vias to internal circuit structures. Rather, a via, such as which would conventionally be formed as part of the connector mounting pad, is formed as part of a separate, adjacent pad. A second end of the capacitor is attached to the adjacent pad, forming an electrical connection between the conductive element and the via through the capacitor. Incorporating capacitors into the footprint reduces the number of vias required, which improves signal integrity. The capacitors may be placed on the printed circuit board separately from the connector or may be incorporated into the connector, allowing the connector and capacitors to be placed in one operation.
申请公布号 US2011104948(A1) 申请公布日期 2011.05.05
申请号 US20090612510 申请日期 2009.11.04
申请人 AMPHENOL CORPORATION 发明人 GIRARD, JR. DONALD A.;GAILUS MARK W.;STOKOE PHILIP T.
分类号 H01R13/66;H05K1/11;H05K1/16;H05K3/34;H05K7/02 主分类号 H01R13/66
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