发明名称 |
On-Chip Accelerated Failure Indicator |
摘要 |
An accelerated failure indicator embedded on a semiconductor chip includes an insulating region; a circuit located inside the insulating region; a heating element located inside the insulating region, the heating element configured to heat the circuit to a temperature higher than an operating temperature of the semiconductor chip; and a reliability monitor configured to monitor the circuit for degradation, and further configured to trigger an alarm in the event that the degradation of the circuit exceeds a predetermined threshold. A method of operating an accelerated failure indicator embedded on a semiconductor chip includes determining an operating temperature of the semiconductor chip; heating a circuit located inside an insulating region of the accelerated failure indicator to a temperature higher than the determined operating temperature; monitoring the circuit for degradation; and triggering an alarm in the event that the degradation of the circuit exceeds a predetermined threshold.
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申请公布号 |
US2011102005(A1) |
申请公布日期 |
2011.05.05 |
申请号 |
US20090610683 |
申请日期 |
2009.11.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FENG KAI D.;FLEISCHMAN THOMAS J.;WANG PING-CHUAN;WEI XIAOJIN;YANG ZHIJIAN |
分类号 |
G01R31/26;G01R31/3187 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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