发明名称 WIRING LAYER, SEMICONDUCTOR DEVICE, AND LIQUID CRYSTAL DISPLAY DEVICE USING SEMICONDUCTOR DEVICE
摘要 <p>Disclosed is a electrode film that does not delaminate from an oxide thin film and wherein copper atoms do not diffuse into the oxide thin film. A wiring layer is configured from a high-density barrier film (37) that is a Cu-Mg-Al thin film, and a copper film (38). The high-density barrier film (37) is put into contact with the oxide thin film. Considering the total number of atoms of copper, magnesium, and aluminum in the high-density barrier film (37) to be 100 at%, when magnesium is contained in the range of between 0.5 and 5 at%, inclusive, and aluminum is contained in the range of between 5 and 15 at%, inclusive, adhesiveness and barrier properties are both achieved, and wiring layers (50a, 50b) are obtained with strong adhesion and wherein copper atoms do not diffuse.</p>
申请公布号 WO2011052471(A1) 申请公布日期 2011.05.05
申请号 WO2010JP68576 申请日期 2010.10.21
申请人 ULVAC, INC.;TAKASAWA, SATORU;SHIRAI, MASANORI;ISHIBASHI, SATORU 发明人 TAKASAWA, SATORU;SHIRAI, MASANORI;ISHIBASHI, SATORU
分类号 H01L21/3205;G02F1/1343;G02F1/1368;H01L21/28;H01L23/52;H01L29/417;H01L29/786 主分类号 H01L21/3205
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