| 发明名称 |
POLYAMIDEIMIDE ADHESIVES FOR PRINTED CIRCUIT BOARDS |
| 摘要 |
The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. In particular, the invention relates to liquid adhesive compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.
|
| 申请公布号 |
CA2779065(A1) |
申请公布日期 |
2011.05.05 |
| 申请号 |
CA20102779065 |
申请日期 |
2010.10.28 |
| 申请人 |
SUN CHEMICAL B.V. |
发明人 |
DAVIS, RICHARD CHARLES;FORD, SIMON RICHARD;HALL, STEPHEN ANTHONY;KLAUS, MATTHIAS;OGNIBENI, KARL-HEINZ |
| 分类号 |
C08G18/80;B32B15/08;C08G18/00;C08G18/28;C08G18/34;C08G18/60;C08G73/14;C09D179/08;C09J175/04;C09J179/08;H01B3/30;H05K1/00;H05K3/00;H05K3/38 |
主分类号 |
C08G18/80 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
