METHOD AND DEVICE FOR DETECTING CRACKS IN SEMICONDUCTOR SUBSTRATES

摘要

The invention relates to a method and device for detecting cracks in planar semiconductor substrates having two opposite lateral surfaces (30, 31) and a circumferential edge surface, such as silicon wafers and solar cells. The method and device are based on the detection of light refracted at a crack (34), which light is introduced into the edge surface of the semiconductor substrate (3) and exits at the crack location on one of the lateral surfaces.