ADHESIVE RESIN COMPOSITION, COVERLAY FILM, AND CIRCUIT BOARD

摘要

Disclosed is an adhesive resin composition containing 100 parts by weight of component (a) which is a polyimide siloxane containing the structural units represented by general formula (1) and (2) (in the formula, Ar represents a tetravalent aromatic group derived from an aromatic tetracarboxylic anhydride, R1 represents a divalent diaminosiloxane residue derived from a diaminosiloxane, R2 represents a divalent aromatic diamine residue derived from an aromatic diamine, and m and n represent the molar ratio of each of the structural units, wherein m is between 0.75 and 1.0, and n is between 0 and 0.25), and 5 to 200 parts by weight of component (b) which is a plate-like inorganic filler, the average particle diameter of which is between 2 and 25µm.