| 摘要 |
PURPOSE: A method for processing cavity of a core substrate is provided to implement accurately the shape of a cavity by forming first and second processing areas. CONSTITUTION: In a method for processing cavity of a core substrate, a first processing area(A1) is formed in one side of a core substrate(10). The first processing area is divided with a circuit pattern(12a). A second processing area(A2) is formed in the other side of the core substrate. The second processing area is divided with a circuit pattern(12b). The first processing area is completely removed. The cavity is processed. The second processing area is wider than that of the first processing area.
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