| 摘要 |
A process for treating a target region of a component surface with a treatment fluid is disclosed, the process comprising:
a) determining an amount of treatment fluid required to treat the target region;
b) feeding the determined amount of treatment fluid to a treatment device 2, 102;
c) continuously circulating the treatment fluid through an applicator 110, 112 of the treatment device 2, 102 whilst applying the applicator to the target region; and
d) discarding the treatment fluid once the target region of the component surface has been treated. An apparatus for treating a target region of a component surface with a treatment fluid is also disclosed, the apparatus comprising:
a treatment fluid reservoir 200;
a treatment device 102, operable to receive treatment fluid from the treatment fluid reservoir 200 and to apply treatment fluid to the component;
a holding fixture 310 for supporting the component; and
a sealable enclosure 300 containing the treatment fluid reservoir 200, the treatment device 102 and the holding fixture 310. |
