<p>A method of forming a device is disclosed. The method includes providing a printed circuit board substrate having a die attach region on a first surface of the substrate. The method also includes attaching a die to a die attach region. The die is electrically coupled to first land pads disposed on the first surface at the periphery of the die attach region. A cap is formed in a target area by a top gate process to produce a cap with an even surface. The cap covers the die and leaves at least the first land pads exposed.</p>
申请公布号
EP2287898(A3)
申请公布日期
2011.05.04
申请号
EP20090173641
申请日期
2009.10.21
申请人
UNITED TEST AND ASSEMBLY CENTER
发明人
ENG, KIAN TENG;MANALAC, RODEL;PARK, TECK WAH;GAN, RICHARD TE