| 摘要 |
PURPOSE: A method for manufacturing a semiconductor wafer is provided to supply a new processing sequence to manufacture a semiconductor wafer whose diameter is 450mm. CONSTITUTION: A semiconductor wafer is processed between two ring shaped rotation processing discs. Each processing disc comprises a processing layer with an abrasive. The edge of the semiconductor wafer is rounded by a grinding disc including an abrasive. The average particle size of the abrasive is from 1.0 to 20.0 micro meters. |
