| 摘要 |
PURPOSE: A light emitting device package and a manufacturing method thereof are provided to uniformly distribute fluorescent substances on a light emitting device. CONSTITUTION: A sub mount(100) comprises a chip area(120) and a support area(110). A light emitting device chip(200) is formed on a chip area of the sub mount. A sealing object(400) includes fluorescent substances formed on the light emitting device ship. The sealing object is formed in a hemi spherical shape. An outer lens is located on the sealing object. |
