发明名称 Thermosetting epoxy resin composition and semiconductor device
摘要 A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by: €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ R 11 -COO-R 12 €ƒ€ƒ€ƒ€ƒ€ƒ(1) wherein R 11 and R 12 are C n H 2n+1 , and n is 1 to 30 and a compound represented by: wherein R 1 , R 2 , and R 3 are selected from H, -OH, -OR, and -OCOC a H b with the proviso that at least one includes -OCOC a H b ; R is C n H zn+1 (wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.
申请公布号 EP2196501(B1) 申请公布日期 2011.05.04
申请号 EP20090252742 申请日期 2009.12.07
申请人 NICHIA CORPORATION 发明人 HAYASHI, MASAKI;TAGUCHI, YUSUKE;TOMIYOSHI, KAZUTOSHI;TADA, TOMOYOSHI
分类号 C08L63/00;H01L23/29 主分类号 C08L63/00
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