| 摘要 |
PURPOSE: A method for polishing a semiconductor wafer is provided to improve the shape of the edge of a semiconductor wafer. CONSTITUTION: A semiconductor wafer(4) is guided by a carrier(5) in which a template(6) is placed. A polishing plate(1) holds a polishing pad. The size of the area of the polishing plate is larger than or the same as the size of the area of a polishing pad. The pocket depth of an overhang(10) of the semiconductor wafer is thinner than the thickness of the semiconductor wafer. The pocket depth of an underhang(9) of the semiconductor wafer is thicker than or the same as the thickness of the semiconductor wafer.
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