发明名称 A printed circuit board and a fabricating method the same
摘要 PURPOSE: A printed circuit board and manufacturing method thereof are provided to simplify a manufacturing process, thereby increasing a production yield. CONSTITUTION: A printed circuit board(100a) comprises an insulating layer(102), a via(110), and an intaglio pattern(112). A via hole and a trench are processed in the insulating layer. The via and the intaglio pattern are formed by plating the via hole and the trench. The internal width of the via hole is narrower than the inlet of the via hole.
申请公布号 KR20110045274(A) 申请公布日期 2011.05.04
申请号 KR20090101761 申请日期 2009.10.26
申请人 发明人
分类号 H05K3/40;H05K3/18 主分类号 H05K3/40
代理机构 代理人
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