发明名称 A COOLING DEVICE WITH THERMOELECTRIC ELEMENT USING LATENT HEAT
摘要 PURPOSE: A device for cooling thermoelectric element by using latent heat is provided to improve the performance of thermoelectric element by efficiently removing the heat generated from a high-temperature part of a thermoelectric element cooling system. CONSTITUTION: A device for cooling thermoelectric element by using latent heat comprises a fin(40), a container part(10), and a thermoelectric element. The fin transfers heat to air. The container part comprises a phase change material. The container part comprises a seat place and a rib structure. The seat place is formed outside the container part. The thermoelectric element performs the efficient heat transfer through the seat place. The rib structure is arranged inside the container part and becomes uniform when the phase change material is under a phase change process. The thermoelectric element locates between the fin and the container part and generates the heat transfer.
申请公布号 KR20110045409(A) 申请公布日期 2011.05.04
申请号 KR20090101973 申请日期 2009.10.26
申请人 发明人
分类号 F28D20/02;B60H1/00;B60H1/32;F28D21/00 主分类号 F28D20/02
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