发明名称 |
IC MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
Subject: to provide a wiring board with a substrate mounted having a low electrical resistance with a built-in inorganic substrate. Means to Solve the Problem: It is set forth such that a silicon substrate 62 is provided with a low-elasticity resin layer 60 being interposed on the multilayer build-up wiring board 100 and that the build-up wiring layers 16, 26 are provided on said silicon substrate 62. The conductor pads for mounting 36b of the multilayer build-up wiring board 100 and the build-up wiring layers 16, 26 are connected by the through-hole conductors 74 formed inside the through holes 64 of the silicon substrate 62. As the connection to interpose the silicon substrate 62 is made through said through-hole conductors 74 without the use of soldering, the electrical resistance of the internal wiring is low. |
申请公布号 |
EP2178116(A4) |
申请公布日期 |
2011.05.04 |
申请号 |
EP20080827123 |
申请日期 |
2008.08.05 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
TANAKA, HIRONORI;KAWANO, SHUICHI |
分类号 |
H01L23/12;H01L23/14;H01L23/15;H01L23/32;H05K3/46 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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