发明名称 LIQUID-COOLED-TYPE COOLING DEVICE CAPABLE OF COOLING DOWN A SEMICONDUCTOR DEVICE
摘要 PURPOSE: A liquid-cooled-type cooling device is provided to improve cooling performance by installing a coolant path between the inlet and outlet for coolant. CONSTITUTION: A coolant flow path is installed in a casing(2) which is comprised of a top wall(3), a bottom wall(4), and a sidewall(5). A plurality of fins are installed in the inside in which the top wall is contacted with the coolant flow path. The coolant flow path is interposed between a coolant inlet(11) and a coolant outlet. The coolant flow path has a cut shape in a horizontal plane vertical to the height of the fin A coolant flows between two adjacent fins.
申请公布号 KR20110046302(A) 申请公布日期 2011.05.04
申请号 KR20100103244 申请日期 2010.10.22
申请人 发明人
分类号 H05K7/20;H01L23/473 主分类号 H05K7/20
代理机构 代理人
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