发明名称 Connector comprising a reinforcing plate to be soldered to a substrate
摘要 <p>Problem to be Solved To provide a connector in which soldering strength of a reinforcing plate can be improved. Solution A reinforcing plate (30) fixed to a connector main body (10) is arranged on a bottom surface of the connector main body (10) to come into surface contact with a surface of a substrate (40) while a plurality of holes (31) is provided on a surface, which contacts the substrate (40), of the reinforcing plate (30). When the reinforcing plate (30) is soldered to the substrate (40), therefore, a solder wraps around not only a peripheral edge of the reinforcing plate (30) but also an edge of each of the holes (31) so that a soldering portion between the reinforcing plate (30) and the substrate (40) can be sufficiently ensured. Thus, soldering strength of the reinforcing plate (30) can be improved, and mounting strength on the substrate (40) can be enhanced for insertion and removal of a counterpart connector. By providing each of the holes (31), the reinforcing plate (30) can be made lightweight, and heat transfer at the time of soldering can also be improved.</p>
申请公布号 EP2317607(A1) 申请公布日期 2011.05.04
申请号 EP20080809209 申请日期 2008.08.22
申请人 IRISO ELECTRONICS CO., LTD. 发明人 IMAZU, TOSHIYUKI;SUZUKI, HITOSHI
分类号 H01R13/73;H01R13/516;H01R107/00;(IPC1-7):H01R12/16;H01R12/04 主分类号 H01R13/73
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