| 摘要 |
<p>PURPOSE: A thermosetting solder resist composition is provided to minimize the destruction of a circuit and facilitate a solder resist processing process using laser. CONSTITUTION: A thermosetting solder resist composition includes an epoxy resin, a phenolic hardener, and a hardening accelerator. The epoxy resin is selected from a group including compounds represented by chemical formula 1 to 3. The phenolic hardener is represented by chemical formula 4. In the chemical formulas, n is an integer of 1 to 10. The solder resist composition further includes a diluent.</p> |
