首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Mold for Manufacturing Semiconductor Package
摘要
申请公布号
KR20110004363(U)
申请公布日期
2011.05.04
申请号
KR20090013953U
申请日期
2009.10.27
申请人
发明人
分类号
H01L21/56
主分类号
H01L21/56
代理机构
代理人
主权项
地址
您可能感兴趣的专利
LIQUID METAL ION SOURCES
GLYCOSIDES ISOLATED FROM THE EUPHORBIACEAE GENUS PHYLLANTHUS AND THEIR ANTI-TUMOUR USE
BACK FLOW PREVENTER, ESPECIALLY FOR WATER SUPPLY CONDUITS
ELECTRODYNAMIC TRANSDUCER
RADIO RECEIVER WITH A FULLY ELECTRONIC CONTROL ARRANGEMENT
APPARATUS FOR MONITORING ENGINES
TELEPHONE DIALLING SYSTEM
GLASS ENCAPSULATED QUARTZ OSCILLATOR
COLUMN FOR LIQUID CHROMATOGRAPHY
DISTRIBUTED PHASE RF COIL
PROCESS FOR PRODUCING A SEMICONDUCTOR DEVICE HAVING AN INSULATING LAYER OF SILICON DIOXIDE COVERED BY A FILM OF SILICON OXYNITRIDE
FOERBAETTRAT ADSORPTIONSFOERFARANDE MED TRYCKSVAENGNING.
LICHTWELLENLEITER-UEBERTRAGUNGSSYSTEM
COMPUTER TESTING ARRANGEMENT
PLATE HEAT EXCHANGER
METHOD AND DEVICE FOR STABILIZING A FEED-BACK SERVOMECHANISM
LIGHTER
DEVICE FOR ADJUSTING THE CIRCUIT AMPLIFICATION OF A SERVO-REGULATING CIRCUIT
STEREOSELECTIVE PROCESS AND CHIRAL INTERMEDIATES FOR ARYLOXYDROPANOLAMINES
STOCKPILE SHROUD