| 摘要 |
A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump.
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