发明名称 |
Substrate anchor structure and method |
摘要 |
An electrical structure and method of forming. The electrical structure includes a first substrate, first dielectric layer, an underfill layer, and a second substrate. The first dielectric layer is formed over a top surface of the first substrate. The first dielectric layer includes a first opening extending through a top surface and a bottom surface of said first dielectric layer. The underfill layer is formed over the top surface of the first dielectric layer and within the first opening. The second substrate is formed over and in contact with the underfill layer.
|
申请公布号 |
US7935408(B2) |
申请公布日期 |
2011.05.03 |
申请号 |
US20070924662 |
申请日期 |
2007.10.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DAUBENSPECK TIMOTHY HARRISON;GAMBINO JEFFREY PETER;MUZZY CHRISTOPHER DAVID;SAUTER WOLFGANG |
分类号 |
B32B3/10;B05D5/12;H01L23/485 |
主分类号 |
B32B3/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|