发明名称 |
Backend interconnect scheme with middle dielectric layer having improved strength |
摘要 |
An integrated circuit structure includes a first, a second and a third metallization layer. The first metallization layer includes a first dielectric layer having a first k value; and first metal lines in the first dielectric layer. The second metallization layer is over the first metallization layer, and includes a second dielectric layer having a second k value greater than the first k value; and second metal lines in the second dielectric layer. The third metallization layer is over the second metallization layer, and includes a third dielectric layer having a third k value; and third metal lines in the third dielectric layer. The integrated circuit structure further includes a bottom passivation layer over the third metallization layer.
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申请公布号 |
US7936067(B2) |
申请公布日期 |
2011.05.03 |
申请号 |
US20080121541 |
申请日期 |
2008.05.15 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
TSAI HAO-YI;LIU YU-WEN;CHEN HSIEN-WEI;CHEN YING-JU;JENG SHIN-PUU |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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