HEAT DISSIPATION DEVICE OF ELECTRONIC CIRCUIT MODULES

摘要

PURPOSE: A heat spreader tool of an electronic circuit module is provided to transmit heat of an IC chip to a plurality of heat transfer bodies through at least one external contract pad or at least one transferring contract pad. CONSTITUTION: A heat radiating element(20) includes a plurality of heat delivery bodies(21). The heat delivery bodies is contacted with at least one delivery contact pad(1022). A housing(30) includes an air flow path. At least one external contact pad(1021) is exposed to the outside of the housing through a front cover(31). When at least one electronic device(11) is operated, a generated head is transferred to the plurality of heat transferring bodies through at least one transferring delivery pad. By the air flow path, the heat is guided to the outside.