发明名称 CAMERA MODULE PACKAGE
摘要 PURPOSE: A camera module package is provided to automatically connect a socket to a grounding unit without an additional grounding work when inserting a housing to a socket. CONSTITUTION: A lens barrel(110) accepts a lens, and a housing(120) is installed inside the lens barrel. A substrate unit(130) contacts the housing, and includes an image sensor on one side thereof. A shield can(140) covers the external portion of the housing, and has a grounding unit(144). The grounding unit contacts the inner plane of the socket by protruding toward from the external plane of the shield can toward the outside when being inserted into a socket(150).
申请公布号 KR20110044397(A) 申请公布日期 2011.04.29
申请号 KR20090101034 申请日期 2009.10.23
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, SANG YEUN
分类号 H04N5/225 主分类号 H04N5/225
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