HIGH THERMAL CONDUCTIVE THERMOPLASTIC RESIN COMPOSITION FOR EXTRUSION MOLDING

摘要

PROBLEM TO BE SOLVED: To provide a resin material for extrusion molding being excellent in thermal conductivity and indicating sufficient appearance without appearance failure such as floating of a filler on a molded article at extrusion molding. SOLUTION: A high thermal conductive thermoplastic resin composition for extrusion molding contains at least a high thermal conductive thermoplastic resin with a specific structure comprising repetition of a unit composed of a mesogen group and a spacer and having the thermal conductivity in a single resin of 0.45 W/(mK) or more. COPYRIGHT: (C)2011,JPO&INPIT