| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To keep a strength of a lead frame, to fine a lead frame, and to prevent problems of unfilling etc. of a sealing resin. <P>SOLUTION: The lead frame 100 includes: a plurality of islands 102 arranged in a matrix and each having semiconductor chip mounted thereon, and a plurality of leads 106 which are arranged at intervals apart from islands 102 around each island 102 and are formed of the same component to the island 102. The lead frame 100 is formed so that the film thickness of the whole island between adjacent islands 102 is thinner than that of the island 102. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
