| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device enabling both a simultaneous imaging of a semiconductor chip and a mounted part and a prevention of a bubble in a thin chip. SOLUTION: In the bonding device which bonds the semiconductor chip sucked by a suction head on an end of a bonding arm in a mounting position, the bonding arm 2 has a translucent portion for imaging which reaches the suction head 30, the suction head 30 includes a head body 31 having a translucent portion, a lower surface of the head body 31 is in a downward convex bending shape, and the head body 31 can elastically deform so that the lower bottom becomes a flat shape by receiving a force of pressing down while contacting a top face of the semiconductor chip. COPYRIGHT: (C)2011,JPO&INPIT |
