发明名称 STRUCTURE OF FLOOR BACKING
摘要 PROBLEM TO BE SOLVED: To provide a simple and low-cost structure of floor backing, which satisfies a legal criteria of heat insulation and which does not require any time-consumitng additional work for reinforcing heat insulation. SOLUTION: On the floor edge f1 on a wall side which is required to be made to a heat insulating structure satisfying the legal heat insulating performance reference value in a floor slab F, a first floor backing X having a high heat insulating performance is installed by paving heat insulating panels 10 made of a foam resin via many mortal dumplings 5 for level adjustment. On the other hand, a second floor backing Y is installed by paving base panels 30 supported by a plurality of support legs 25 for level adjustment on the remaining floor center f2, and one floor backing B is build by integrally connecting the first floor backing X and the second floor backing Y having a different floor structure by a connecting means A. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011084983(A) 申请公布日期 2011.04.28
申请号 JP20090240195 申请日期 2009.10.19
申请人 YUKA SANSHO KENZAI KK 发明人 MIYAMOTO NOBUYUKI;UEDA TAKESHI
分类号 E04F15/00 主分类号 E04F15/00
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