发明名称 MOISTURE-CURING TYPE REACTIVE HOT-MELT ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide a moisture-curing type reactive hot-melt adhesive that has excellent initial curability, and can reduce aging time required to e.g. stack adhered articles and until transferring to next working stage. SOLUTION: The moisture-curing type reactive hot-melt adhesive includes an isocyanate-terminated urethane prepolymer obtained by reaction of a polyol composition (A) that includes a polyether polyol (a1) having at least an EO-PO random copolymer structure, a rosin resin polyol (a2) whose hydroxyl value is at least 50, and a polyester polyol (a3), with a polyfunctional isocyanate compound (B). COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011084686(A) 申请公布日期 2011.04.28
申请号 JP20090240169 申请日期 2009.10.19
申请人 AICA KOGYO CO LTD 发明人 NISO TAKASHI;MASE YUKA
分类号 C09J175/06;C09J175/08;C09J193/04 主分类号 C09J175/06
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