| 摘要 |
The present invention discloses a method for manufacturing an Organic-Electronic (OE) Device. The method comprises providing at least one lower electrode onto a substrate; providing at least one lower organic layer onto the lower electrode; providing at least one upper electrode onto the lower organic layer to obtain an OE stack; providing a glue, providing a cover, and dicing the OE stack into a plurality of OE dies, and providing a plurality of side-contact electrodes on at least one sidewall of the OE dies. A plurality of voltages is respectively applicable to the plurality of side-contacted electrodes such that the plurality of side-contacted electrodes become electrically connected over the at least one organic layer.
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