发明名称 |
POLYAMIC ACID SOLUTION, POLYIMIDE RESIN, AND FLEXIBLE COPPER CLAD LAMINATE USING SAME |
摘要 |
The present invention relates to a polyamic acid solution comprising: (a) an aromatic tetracarboxylic acid dianhydride comprising 3,3',4,4'-biphenyltetracarboxylic acid dianhydride (BPDA) and pyromellitic dianhydride (PMDA); (b) an aromatic diamine; and (c) a solvent, and a polyimide resin prepared by imidization of the polyamic acid solution. A flexible copper clad laminate with excellent flexibility can be prepared by using the polyimide resin. |
申请公布号 |
WO2011049357(A2) |
申请公布日期 |
2011.04.28 |
申请号 |
WO2010KR07173 |
申请日期 |
2010.10.20 |
申请人 |
DOOSAN CORPORATION;KIM, WON KYUM;KIM, HYUNG WAN;YANG, DONG BO |
发明人 |
KIM, WON KYUM;KIM, HYUNG WAN;YANG, DONG BO |
分类号 |
C08G73/10;C08L79/08;H05K3/46 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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