PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board that can prevent cracks between a circuit pattern and resin by covering the circuit pattern with a primer resin. SOLUTION: A method of manufacturing the printed circuit board includes steps of: providing a carrier on which a primer resin layer is formed; forming the circuit pattern on the primer resin layer; laminating the carrier on an insulating layer so that the circuit pattern is buried in the insulating layer; removing the carrier (S140); forming a via hole on an insulating layer on a surface on which the primer resin layer is laminated; and forming a plated layer in the via hole and on the primer resin layer, and then forming a via in the via hole by removing the plated layer formed on the primer resin layer. COPYRIGHT: (C)2011,JPO&INPIT