| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus avoiding a contact between a substrate and a plate and heating the substrate with a high uniformity. SOLUTION: The substrate processing apparatus 1 includes a plurality of side rollers 20 arranged on both sides of the heating plate 10 and a plurality of center rollers 30 arranged at sections other than both ends on the heating plate 10. Because the substrate is conveyed while being supported on the side rollers 20 and the center rollers 30, the contact between the heating plate 10 and the substrate can be avoided. Furthermore, the center roller 30 is indirectly rotated via a drive shaft 53 arranged below the heating plate 10. Thus, the center roller 30 can be arranged at a position higher than the drive shaft 53, and a radius of the center roller 30 and a length of a through-hole for providing the center roller 30 can be set smaller. Therefore, the heating plate 10 can heat the substrate with the high uniformity. COPYRIGHT: (C)2011,JPO&INPIT |
