| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a conductor pattern which holds the width in the top part of a conductor, and also, can suppress the hollowed part in the middle part of the conductor. SOLUTION: Regarding the method for forming a conductor pattern (2) in which a part not covered with an etching resist in a copper layer is sprayed with an etching liquid by a flat spray nozzle, and the part not covered with the etching resist is subjected to etching, the etching liquid is composed of an aqueous solution comprising a cupic ion source, acid and azoles, and the spraying amount of the etching liquid per unit area in the surface of the copper layer is 35 to 450 L/(min.m<SP>2</SP>). COPYRIGHT: (C)2011,JPO&INPIT
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