| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which can give a spacer which can reduce the size of warpage produced on a semiconductor wafer assembly, when the semiconductor wafer assembly is formed by joining the semiconductor wafer and transparent substrate through the spacer, and to provide a semiconductor wafer assembly and semiconductor device where the size of warpage is reduced. SOLUTION: The resin composition is used to provide a spacer 104 having a shape of lattice in a planar view which is placed between a semiconductor wafer 101' and transparent substrate 102, and is configured to include constituent materials having alkali-soluble resin, thermosetting resin, and photopolymerization initiator. When the semiconductor wafer 101' and transparent substrate 102 are joined through the spacer 104, the spacer 104 is formed on the whole surface (in a planer view) and then the size of warpage is 3,000μm or less when the thickness of semiconductor wafer 101' is reduced to 1/5. COPYRIGHT: (C)2011,JPO&INPIT
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