| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump forming method and a wiring board, such that simple processes and excellent electric connections can be obtained. SOLUTION: The bump forming method includes: a step 1 in which a through-hole 15 for bump formation is formed on a substrate 11; a laminating step 2 in which a first conductor layer 41 is laminated on the back surface of the substrate 11; a burying step 3 in which a solder ingot 25 is buried in the through-hole 15 before or after the laminating step and the solder ingot 25 is partially protruded from an opening of the through-hole 15 to form a projection on the top surface of the substrate 11; and a connection step 4 in which a resin layer 23 is heated and fused to fill the through-hole 15, and the first conductor 41 and solder ingot 25 are electrically connected to each other, wherein the solder ingot 25 has a solder layer 22 made of solder and the resin layer 23 formed outside the solder layer 22 and containing a flux active compound. COPYRIGHT: (C)2011,JPO&INPIT |
