| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that a protruding heat conductive gel may stick to an electronic component around a semiconductor element in the case where the heat conductive gel protruding from between the semiconductor element and a heatsink under the external force such as vibration is not housed in the recess formed in the heatsink, or in the case where all of them can not be housed. SOLUTION: A protruding heat conductive gel 25 advances into the interior of an annular conduit 31 of square shape formed in a heatsink 30, and remains there. An annular wall 32 prevents protruding of the heat conductive gel 25 even if the protruding heat conductive gel 25 is totally housed in the annular conduit 31. Then there is a low possibility of the heat conductive gel 25 protruding by overflowing the annular conduit 31 and the annular wall 32. Thus, the possibility of an the heat conductive gel 25 sticking to an electronic component of a printed wiring board 14 is reduced. COPYRIGHT: (C)2011,JPO&INPIT |
