| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component-mounting apparatus and an electronic component-mounting method that can increase a degree of freedom in operation to mount electronic components on large-size and small-size substrates. <P>SOLUTION: A substrate conveyance path 21 comprises first to fourth conveyors 21A to 21D, the two conveyors 21A and 21D at both side parts being outside-reference-inside-movable conveyors and the two conveyors 21B to 21C at a center part being inside-reference-outside-movable conveyors. The electronic component-mounting method is characterized in that it is possible to select: a small-size substrate-mounting mode in which the four conveyors 21A to 21D are equalized in substrate conveyance width and electronic components are mounted on four small-size substrates of equal width; a large-size substrate mounting mode in which the movable conveyors are all placed closely to the center part of the substrate conveyance path 21 and electronic components are mounted on two large-size substrates by the two conveyors 21A and 21D; or a both large-size and small-size substrate-mounting mode in which the two conveyors 21C and 21D on one side among the four conveyors 21A to 21D are placed in the small-size substrate-mounting mode and the conveyor 21A on the other side is placed in the large-size substrate-mounting mode. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
