| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device capable of easily obtaining individual identification information displayed on an information display region of an electronic component. SOLUTION: In a resin-sealed semiconductor device 10, an adherence suppressing material 44 for suppressing adherence between an information display region 42 of an IC element 18 and a molding resin 16 is interposed between the information display region 42 and the molding resin 16. Accordingly, even when, in order to obtain individual identification information 40, a portion of the molding resin 16 is removed by such as being scraped so that the information display region 42 is exposed outside, adherence between the information display region 42 and the mold resin 16 is suppressed and therefore the information display region 42 can be easily exposed outside. COPYRIGHT: (C)2011,JPO&INPIT |
