HIGHLY HEAT RESISTANT ALUMINUM HYDROXIDE PARTICLE, PREPARATION METHOD THEREFOR, RESIN COMPOSITION CONTAINING THE SAME AND PRINTED CIRCUIT BOARD USING THE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a preparation method for a highly heat resistant aluminum hydroxide particle having heat resistance and flame retardancy suitable to be used for a substrate for a printed circuit board and the like which has characteristics adaptable to lead free soldering. SOLUTION: In the highly heat resistance aluminum hydroxide particle, at least gibbsite type aluminum and boehmite type aluminum hydroxide are present in one aluminum hydroxide particle. The specific surface area by the BET method is 2.0-50.0 m2/g, while the amount of dehydration is 31.5-34.0 mass% and the temperature of starting heat decomposition is higher than 260°C. The method is for the preparation of the particle. COPYRIGHT: (C)2011,JPO&INPIT