PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE SHEET, AND SEMICONDUCTOR DEVICES USING SAME

摘要

A photosensitive adhesive composition which comprises (A) an epoxy compound, (B) a soluble polyimide that contains residues of a diamine represented by general formula (2), (C) a photopolymerizable compound, and (D) a photopolymerization initiator, wherein the epoxy compound (A) contains an epoxy compound represented by general formula (1) and the soluble polyimide (B) contains residues of a diamine represented by general formula (2). In general formula (1), m and n are integers of 0 or larger that satisfy the relationship: 1 = m+n = 10; and x is an integer of 1 to 5, and y is an integer of 1 to 10, with x and y satisfying the relationship: y = 2x. In general formula (2), R1 to R8 may be the same or different from each other and are each selected from the group consisting of hydrogen atom, C1-30 alkyl, C1-30 alkoxy, halogen, sulfone group, nitro, and cyano. The photosensitive adhesive composition can be developed after light exposure by means of an alkali developer, exhibits high bond strength when applied to a substrate by thermocompression, and ensures excellent insulation reliability.