发明名称 |
CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
There is provided a method of manufacturing a conductive film. The method includes: (a) providing an anodized layer having a plurality of through holes extending therethrough in its thickness direction; (b) forming a plurality of linear conductors by filling each of the through holes with a conductive material; (c) forming protection layers on both surfaces of the anodized layer; (d) removing the anodized layer to form a plurality of gaps between the linear conductors; (e) forming an organic insulation layer between the protection layers to fill the gaps with the organic insulation layer; and (f) removing the protection layers. |
申请公布号 |
US2011095433(A1) |
申请公布日期 |
2011.04.28 |
申请号 |
US20100908943 |
申请日期 |
2010.10.21 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
HORIUCHI MICHIO;TOKUTAKE YASUE;MATSUDA YUICHI;KOBAYASHI TSUYOSHI;DENDA TATSUAKI |
分类号 |
H01L23/535;B05D5/12;H01L21/768;H05K1/02 |
主分类号 |
H01L23/535 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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