发明名称 CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 There is provided a method of manufacturing a conductive film. The method includes: (a) providing an anodized layer having a plurality of through holes extending therethrough in its thickness direction; (b) forming a plurality of linear conductors by filling each of the through holes with a conductive material; (c) forming protection layers on both surfaces of the anodized layer; (d) removing the anodized layer to form a plurality of gaps between the linear conductors; (e) forming an organic insulation layer between the protection layers to fill the gaps with the organic insulation layer; and (f) removing the protection layers.
申请公布号 US2011095433(A1) 申请公布日期 2011.04.28
申请号 US20100908943 申请日期 2010.10.21
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 HORIUCHI MICHIO;TOKUTAKE YASUE;MATSUDA YUICHI;KOBAYASHI TSUYOSHI;DENDA TATSUAKI
分类号 H01L23/535;B05D5/12;H01L21/768;H05K1/02 主分类号 H01L23/535
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