SUBSTRATE AND METHOD FOR MANUFACTURING CIRCUIT DEVICE USING SAME

摘要

Provided are a substrate which is prevented from being bent during a transfer step, and a method for manufacturing a circuit device using the same. A substrate (10) is provided with a mounting substrate region (24) comprising a plurality of mounting substrates (12) disposed adjacent to each other, and a first support part (14) and a second support part (16) that are continuous with the plurality of mounting substrates (12). First separation grooves (30) are provided in boundary portions between the mounting substrates (12), and second separation grooves (32) are provided between the mounting substrates (12), and the first support part (14) and the second support part (16). By providing the first support part (14) and the second support part (16), the substrate (10) is prevented from being bent in the stage in which the substrate (10) is transferred.