发明名称 MEMORY DEVICE AND FABRICATION PROCESS THEREOF
摘要 A memory device that includes a resistive-change memory element, the memory device includes: a first memory element that includes a first resistive-change layer and a first electrode connected to the first resistive-change layer; and a second memory element that includes a second resistive-change layer and a second electrode connected to the second resistive-change layer, wherein at least one of the thickness and the material of the second resistive-change layer and the area of the second electrode in contact with the second resistive-change layer is different from the corresponding one of the thickness and the material of the first resistive-change layer and the area of the first electrode in contact with the first resistive-change layer.
申请公布号 US2011095255(A1) 申请公布日期 2011.04.28
申请号 US20100906214 申请日期 2010.10.18
申请人 SONY CORPORATION 发明人 SUMINO JUN;YASUDA SHUICHIRO
分类号 H01L45/00;H01L21/02 主分类号 H01L45/00
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