| 摘要 |
<p>A device-mounting structure comprises a substrate; a through-wiring substrate which has a plurality of through-wiring lines formed in a plurality of through-holes which penetrate the substrate from one of the main faces of the substrate to the other of the main faces of the substrate, that is, from a first main face to a second main face; a first device which has a plurality of electrodes, and is disposed such that these electrodes oppose the first main face; and a second device which has a plurality of electrodes with an arrangement differing from that of the electrodes of the first device, and is disposed such that these electrodes oppose the second main face; wherein each of the through-wiring lines has a first conductive part placed on the first main face at a position corresponding to an electrode of the first device, and a second conductive part placed on the second main face at a position corresponding to an electrode of the second device; each of the electrodes of the first device is connected electrically to a respective first conductive part, and each of the electrodes of the second device is connected electrically to a respective second conductive part; and each of the through-wiring lines has a straight portion or portions extending perpendicularly from either the first main face and/or the second main face.</p> |
