| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a machining device configured to satisfy a request for flatness and uniformity in machining with sufficient accuracy, and also to provide a machining method using the same. <P>SOLUTION: A polishing device 1 includes: a substrate holding mechanism 10 for holding a substrate W; a polishing pad 22 capable of machining the substrate W; and a polishing head 20 for holding the polishing pad 22 to face the substrate W held at the substrate holding mechanism 10, and is configured to machine the substrate W by bringing the polishing pad 22 into contact with the substrate W. The polishing device 1 includes: a flexible container 14 arranged at the substrate holding mechanism 10 and enclosing a functional material F<SB>1</SB>capable of reversibly changing physical property; and a control device for controlling the physical property of the functional material F<SB>1</SB>. The polishing device 1 is configured to adjust contact pressure generated between the substrate W and the polishing pad 22 when bringing the polishing pad 22 into contact with the substrate W by controlling the physical property of the functional property F<SB>1</SB>by the control device. <P>COPYRIGHT: (C)2011,JPO&INPIT |
