| 摘要 |
The present invention provides a laser dicing method that optimizes an irradiation pattern of a pulse laser beam to control generation of a crack and has a superior cutting characteristic. The laser dicing method includes loading a work piece on a stage, generating a clock signal, emitting a pulse laser beam synchronized with the clock signal, relatively moving the work piece and the pulse laser beam, and switching irradiation and non-irradiation of the pulse laser beam onto the work piece in the unit of a light pulse by controlling pass and interception of the pulse laser beam in synchronization with the clock signal, thereby forming a crack running up to a work piece surface in the work piece.
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