SLOPING PIN STRUCTURE AND DIE ASSEMBLY USING THE SAME

摘要

A sloping pin structure applied to a die assembly for assembly within a molding machine such as plastic injection molding machine is disclosed. The sloping pin structure includes a guiding rod and a sloping pin head. The guiding rod has a first resisting surface and a substantially arcuate peripheral second resisting surface. The first resisting surface and the second resisting surface cooperatively form the outer peripheral surface of the guiding rod. The sloping pin head protrudes outwardly from the first resisting surface and is positioned adjacent to one distal end of the guiding rod.